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IMP Standard Process Capability
Process Technology Summary
Process
# Poly Layers
# Metal Layers
BiCMOS
E2
Low Threshold
High p Poly
Low TC Poly Resistors
Schottky Diode
High-Voltage Bipolar
Low-Voltage CMOS (v)
High-Voltage CMOS (v)
C0809
2
2
5
C0810
2
2
5
C1004
1
2
5
C1012
1
2
5
C1015
2
2
5
C1026
2
2
5
20
C1027
2
2
5
20
C1028
2
2
5
20
C1029
2
2
5
20
C1201
1
2
5
C1202
2
2
5
C1203
2
2
5
C1206
2
2
5
C1209
2
2
5
C1210
2
2
5
C1212
2
2
12
5
C1215
2
2
5
C1216
2
2
15
C1219
2
2
5
C1221
2
2
5
C1225
1
2
5
C1226
2
2
5
100
C1227
2
2
30
C1229
2
2
5
30
C1230
2
2
5
C1231
2
2
30
5
30
C1232
2
2
5
C1601
2
2
5
C3013
2
1
5
10
C3014
2
1
5
10
C3015
1
1
10
C3017
2
2
10
C3025
2
1
10
C5014
2
1
15
Power Management
PWM Controllers
uP Supervisors
Low Dropout Regulators
USB Power Switches
Electroluminescent Lamp Drivers
Data Communications
UART Products
Single-Ended SCSI Terminators
Multimode LVD SCSI Terminators
PCM Digital Switch
Wafer Foundry
Foundry Service
Process Capability
Wafer Foundry Handbook
DS－IMP Standard Process Capability
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